Last edited by Yorg
Thursday, October 15, 2020 | History

2 edition of Quantitative comparison of electronic component-solder joint stress relief in encapsulated assemblies found in the catalog.

Quantitative comparison of electronic component-solder joint stress relief in encapsulated assemblies

D. A. Cummings

Quantitative comparison of electronic component-solder joint stress relief in encapsulated assemblies

topical report

by D. A. Cummings

  • 8 Want to read
  • 39 Currently reading

Published by Dept. of Energy, for sale by the National Technical Information Service] in [Washington], [Springfield, Va .
Written in English

    Subjects:
  • Electric cables -- Joints.,
  • Electric resistance.

  • Edition Notes

    Statementby D. A. Cummings.
    SeriesBDX ; 613-1868/rev, BDX -- 613-1868 (rev.)
    ContributionsUnited States. Dept. of Energy., Bendix Corporation. Kansas City Division. Communications Services.
    The Physical Object
    Pagination24 leaves :
    Number of Pages24
    ID Numbers
    Open LibraryOL17649665M


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Quantitative comparison of electronic component-solder joint stress relief in encapsulated assemblies by D. A. Cummings Download PDF EPUB FB2