2 edition of Quantitative comparison of electronic component-solder joint stress relief in encapsulated assemblies found in the catalog.
Quantitative comparison of electronic component-solder joint stress relief in encapsulated assemblies
D. A. Cummings
by Dept. of Energy, for sale by the National Technical Information Service] in [Washington], [Springfield, Va
Written in English
|Statement||by D. A. Cummings.|
|Series||BDX ; 613-1868/rev, BDX -- 613-1868 (rev.)|
|Contributions||United States. Dept. of Energy., Bendix Corporation. Kansas City Division. Communications Services.|
|The Physical Object|
|Pagination||24 leaves :|
|Number of Pages||24|
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